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381LX331M250K012

381LX331M250K012

381LX331M250K012

Cornell Dubilier Electronics

CAP ALUM 330UF 20% 250V SNAP

SOT-23

381LX331M250K012 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Package / Case Radial
Number of Pins 2
Dielectric MaterialAluminium
Weight 30.000004g
Tolerance 20%
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 2
Termination Snap in
ECCN Code EAR99
Resistance 502mOhm
Terminal Finish Tin (Sn)
Max Operating Temperature105°C
Min Operating Temperature -40°C
Capacitance 330μF
Voltage - Rated DC 250V
Lead Pitch 10mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 502mOhm
Polarity POLARIZED
Lead Diameter 800 μm
Ripple Current1.2A
Test Frequency120Hz
Life (Hours) 3000 hours
Current - Leakage 4mA
Custom Capabilities PVC Insulated Can
Diameter 30mm
Height 25mm
Height Seated (Max) 27.0002mm
Length 25mm
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
In-Stock:2158 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.12000$3.12
500$3.0888$1544.4
1000$3.0576$3057.6
1500$3.0264$4539.6
2000$2.9952$5990.4
2500$2.964$7410

About 381LX331M250K012

The 381LX331M250K012 from Cornell Dubilier Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 330UF 20% 250V SNAP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 381LX331M250K012, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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