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UVP1A220MDD1TD

UVP1A220MDD1TD

UVP1A220MDD1TD

Nichicon

CAP ALUM 22UF 20% 10V RADIAL

SOT-23

UVP1A220MDD1TD Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 19 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Terminal Shape WIRE
Dielectric MaterialAluminium
Operating Temperature-40°C~85°C
PackagingCut Tape (CT)
Published 2015
Series UVP
Size / Dimension 0.197Dia 5.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
HTS Code8532.22.00
Capacitance 22μF
Voltage - Rated DC 10V
Packing Method AMMO PACK
Lead Pitch 2.0066mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Polarity NON-POLARIZED
Lead Spacing0.098 2.50mm
Lifetime @ Temp 2000 Hrs @ 85°C
Leakage Current 0.0066mA
Ripple Current57mA
Polarization Bi-Polar
Life (Hours) 2000 hours
Tan Delta 0.24
In-Stock:21090 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.347851$0.347851
10$0.328161$3.28161
100$0.309586$30.9586
500$0.292062$146.031
1000$0.275530$275.53

About UVP1A220MDD1TD

The UVP1A220MDD1TD from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 22UF 20% 10V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the UVP1A220MDD1TD, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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