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UST1V330MDD1TE

UST1V330MDD1TE

UST1V330MDD1TE

Nichicon

CAP ALUM 33UF 20% 35V THRU HOLE

SOT-23

UST1V330MDD1TE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Mounting Type Through Hole
Package / Case Radial, Can
Surface MountNO
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-55°C~105°C
PackagingTape & Reel (TR)
Series UST
Size / Dimension 0.315Dia 8.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Voltage - Rated 35V
HTS Code8532.22.00
Capacitance 33μF
Packing Method AMMO PACK
Terminal Pitch5mm
Reach Compliance Code compliant
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.138 3.50mm
Rated (DC) Voltage (URdc) 35V
Lifetime @ Temp 1000 Hrs @ 105°C
Leakage Current 0.01155mA
Polarization Polar
Ripple Current @ Low Frequency 72mA @ 120Hz
Ripple Current @ High Frequency 108mA @ 10kHz
Diameter 8mm
Height Seated (Max) 0.315 8.00mm
Length 7mm
RoHS StatusRoHS Compliant
In-Stock:4813 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About UST1V330MDD1TE

The UST1V330MDD1TE from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 33UF 20% 35V THRU HOLE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the UST1V330MDD1TE, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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