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UPW2W330MHH

UPW2W330MHH

UPW2W330MHH

Nichicon

CAP ALUM 33UF 20% 450V RADIAL

SOT-23

UPW2W330MHH Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-25°C~105°C
PackagingBulk
Published 2003
Series UPW
Size / Dimension 0.709Dia 18.00mm
Tolerance ±20%
JESD-609 Code e0
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Applications General Purpose
Additional FeatureNON SOLVENT-PROOF
HTS Code8532.22.00
Capacitance 33μF
Voltage - Rated DC 450V
Packing Method TAPE
Lead Pitch 7.493mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.295 7.50mm
Lifetime @ Temp 8000 Hrs @ 105°C
Leakage Current 0.694mA
Ripple Current145mA
Polarization Polar
Life (Hours) 8000 hours
Tan Delta 0.25
Ripple Current @ Low Frequency 145mA @ 120Hz
Ripple Current @ High Frequency 232mA @ 10kHz
Diameter 18mm
Height 35.5mm
Height Seated (Max) 1.398 35.50mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:3399 items

About UPW2W330MHH

The UPW2W330MHH from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 33UF 20% 450V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the UPW2W330MHH, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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