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UPW1J331MHH

UPW1J331MHH

UPW1J331MHH

Nichicon

CAP ALUM 330UF 20% 63V RADIAL

SOT-23

UPW1J331MHH Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-55°C~105°C
PackagingBulk
Published 2003
Series UPW
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
JESD-609 Code e0
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
Termination Radial
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Applications General Purpose
HTS Code8532.22.00
Capacitance 330μF
Voltage - Rated DC 63V
Lead Pitch 5.0038mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.197 5.00mm
Lifetime @ Temp 7000 Hrs @ 105°C
Leakage Current 0.6237mA
Ripple Current838.5mA
Polarization Polar
Life (Hours) 7000 hours
Tan Delta 0.09
Impedance85mOhm
Ripple Current @ Low Frequency 838.5mA @ 120Hz
Ripple Current @ High Frequency 1.29A @ 100kHz
Diameter 12.5mm
Height 20mm
Height Seated (Max) 0.787 20.00mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:2383 items

About UPW1J331MHH

The UPW1J331MHH from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 330UF 20% 63V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the UPW1J331MHH, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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