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UKL2A100MPD1TD

UKL2A100MPD1TD

UKL2A100MPD1TD

Nichicon

Aluminum Electrolytic Capacitors - Leaded 10uF 100V 85c 8x11.5 20%

SOT-23

UKL2A100MPD1TD Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 19 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Dielectric MaterialALUMINUM
Operating Temperature-40°C~85°C
PackagingTape & Box (TB)
Published 2015
Series UKL
Size / Dimension 0.315Dia 8.00mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Radial
ECCN Code EAR99
Applications General Purpose
HTS Code8532.22.00
Capacitance 10μF
Voltage - Rated DC 100V
Terminal Pitch3.5mm
Lead Pitch 3.5052mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.138 3.50mm
Lifetime @ Temp 2000 Hrs @ 85°C
Ripple Current90mA
Polarization Polar
Life (Hours) 2000 hours
Ripple Current @ Low Frequency 90mA @ 120Hz
Ripple Current @ High Frequency 180mA @ 10kHz
Diameter 8mm
Height Seated (Max) 0.492 12.50mm
Length 11.5mm
RoHS StatusROHS3 Compliant
In-Stock:10104 items

Pricing & Ordering

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About UKL2A100MPD1TD

The UKL2A100MPD1TD from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features Aluminum Electrolytic Capacitors - Leaded 10uF 100V 85c 8x11.5 20%.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the UKL2A100MPD1TD, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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