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RNR5UT7E9310FMM761

RNR5UT7E9310FMM761

RNR5UT7E9310FMM761

VISHAY

RNR5UT7E9310FMM761 datasheet pdf and Evaluation, Development Board Enclosures product details from VISHAY stock available on our website

SOT-23

RNR5UT7E9310FMM761 Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 7 months ago)
Lifecycle Status 30 Weeks
Mount -
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 5
Operating Temperature -55°C ~ 150°C
Packaging Tape & Reel (TR)
Pbfree Code -
Part Status Active
Moisture Sensitivity Level (MSL) 1
Number of Terminations 7
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Sensors/Transducers
Voltage - Supply -
Base Part Number Fehy Gpyww
Output Voltage 95 V
Output Type P-Channel
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 700 μA
Nominal Supply Current 1.5 mA
Output Current 40 mA
Max Supply Current 700 μA
Slew Rate 0.1V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type -
In-Stock:3527 items

About RNR5UT7E9310FMM761

The RNR5UT7E9310FMM761 from VISHAY is a high-performance microcontroller designed for a wide range of embedded applications. This component features RNR5UT7E9310FMM761 datasheet pdf and Evaluation, Development Board Enclosures product details from VISHAY stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RNR5UT7E9310FMM761, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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