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MX30UF1G18AC-XQI

MX30UF1G18AC-XQI

MX30UF1G18AC-XQI

Macronix

Memory IC 8mm mm

SOT-23

MX30UF1G18AC-XQI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Surface MountYES
PackagingTray
Part StatusActive
Number of Terminations 48
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch0.8mm
[email protected] Reflow Temperature-Max (s) 40
JESD-30 Code R-PBGA-B48
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Supply Voltage-Max (Vsup) 1.95V
Temperature GradeINDUSTRIAL
Supply Voltage-Min (Vsup) 1.7V
Operating ModeASYNCHRONOUS
Organization 128MX8
Memory Width 8
Memory Density 1073741824 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage1.8V
Height Seated (Max) 1mm
Length 8mm
Width 6mm
RoHS StatusRoHS Compliant
In-Stock:2501 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MX30UF1G18AC-XQI Product Details

MX30UF1G18AC-XQI Overview


There is a Tray case available. 48 terminations are planted on the chip. As many as 1 functions are supported for comprehensive working. In order to power this memory device, 1.8V will be necessary. To alter the state of certain nonvolatile memory arrays, 1.8V programming voltage is required. A FLASH-type memory IC is used in this chip. Only use it above 85°C. There is a requirement for the part to operate at a temperature of -40°C instead of anything else.

MX30UF1G18AC-XQI Features



MX30UF1G18AC-XQI Applications


There are a lot of Macronix MX30UF1G18AC-XQI Memory applications.

  • eDRAM
  • servers
  • personal digital assistants
  • networking
  • cell phones
  • mainframes
  • main computer memory
  • Cache memory
  • data buffer
  • Camcorders

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