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MS27468T19F11SB

MS27468T19F11SB

MS27468T19F11SB

TE CONNECTIVITY LTD

MS27468T19F11SB datasheet pdf and Unclassified product details from TE CONNECTIVITY LTD stock available on our website

SOT-23

MS27468T19F11SB Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type CABLE AND PANEL
Shell Material ALUMINUM ALLOY
Connector Type MIL SERIES CONNECTOR
Additional FeatureSTANDARD: MIL-DTL-38999, POLARIZED
Contact Finish - Mating NOT SPECIFIED
MIL Conformance YES
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 11
Shell Finish NICKEL PLATED
Mating Information MULTIPLE MATING PARTS AVAILABLE
Contact Gender FEMALE
Empty Shell NO
Backshell Type SOLID
Body/Shell Style RECEPTACLE
Environmental Characteristics ENVIRONMENT RESISTANT
Shell Size 19
Termination Type CRIMP
Coupling Type BAYONET
In-Stock:292 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$35.80000$35.8
500$35.442$17721
1000$35.084$35084
1500$34.726$52089
2000$34.368$68736
2500$34.01$85025

About MS27468T19F11SB

The MS27468T19F11SB from TE CONNECTIVITY LTD is a high-performance microcontroller designed for a wide range of embedded applications. This component features MS27468T19F11SB datasheet pdf and Unclassified product details from TE CONNECTIVITY LTD stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MS27468T19F11SB, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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