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MS27467T23F53SB-LC

MS27467T23F53SB-LC

MS27467T23F53SB-LC

TE CONNECTIVITY LTD

MS27467T23F53SB-LC datasheet pdf and Unclassified product details from TE CONNECTIVITY LTD stock available on our website

SOT-23

MS27467T23F53SB-LC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type CABLE
Shell Material ALUMINUM ALLOY
Connector Type MIL SERIES CONNECTOR
Additional FeatureSTANDARD: MIL-DTL-38999, POLARIZED
Contact Finish - Mating NOT SPECIFIED
MIL Conformance YES
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 53
Shell Finish NICKEL PLATED
Mating Information MULTIPLE MATING PARTS AVAILABLE
Contact Gender FEMALE
Empty Shell YES
Backshell Type SOLID
Body/Shell Style PLUG
Environmental Characteristics ENVIRONMENT RESISTANT
Shell Size 23
Termination Type CRIMP
Coupling Type BAYONET
In-Stock:2312 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$57.98000$57.98
10$54.56600$545.66
25$52.86120$1321.53
50$49.45080$2472.54
100$46.72250$4672.25

About MS27467T23F53SB-LC

The MS27467T23F53SB-LC from TE CONNECTIVITY LTD is a high-performance microcontroller designed for a wide range of embedded applications. This component features MS27467T23F53SB-LC datasheet pdf and Unclassified product details from TE CONNECTIVITY LTD stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MS27467T23F53SB-LC, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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