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MS27466T19F11BA

MS27466T19F11BA

MS27466T19F11BA

TE CONNECTIVITY LTD

MS27466T19F11BA datasheet pdf and Unclassified product details from TE CONNECTIVITY LTD stock available on our website

SOT-23

MS27466T19F11BA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type CABLE AND PANEL
Shell Material ALUMINUM ALLOY
ECCN Code EAR99
Connector Type MIL SERIES CONNECTOR
Additional FeatureSTANDARD: MIL-DTL-38999, POLARIZED
HTS Code8536.69.40.20
MIL Conformance YES
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 11
Shell Finish NICKEL PLATED
Mating Information MULTIPLE MATING PARTS AVAILABLE
Contact Gender FEMALE
Empty Shell YES
Backshell Type SOLID
Body/Shell Style RECEPTACLE
Environmental Characteristics ENVIRONMENT RESISTANT
Shell Size 19
Termination Type CRIMP
Coupling Type BAYONET
In-Stock:238 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$51.31000$51.31
10$48.28800$482.88
25$46.77920$1169.48
50$43.76100$2188.05
100$41.34660$4134.66

About MS27466T19F11BA

The MS27466T19F11BA from TE CONNECTIVITY LTD is a high-performance microcontroller designed for a wide range of embedded applications. This component features MS27466T19F11BA datasheet pdf and Unclassified product details from TE CONNECTIVITY LTD stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MS27466T19F11BA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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