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LNT1H223MSEB

LNT1H223MSEB

LNT1H223MSEB

Nichicon

CAP ALUM 22000UF 20% 50V SCREW

SOT-23

LNT1H223MSEB Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 21 Weeks
Mounting Type Chassis Mount
Package / Case Radial, Can - Screw Terminals
Surface MountNO
Terminal Shape BINDING POST
Mounting FeatureSTUD MOUNT
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~105°C
PackagingBulk
Series LNT
Size / Dimension 2.008Dia 51.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
Applications General Purpose
Voltage - Rated 50V
HTS Code8532.22.00
Capacitance 22000μF
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.866 22.00mm
Rated (DC) Voltage (URdc) 50V
Lifetime @ Temp 2000 Hrs @ 105°C
Leakage Current 3.14mA
Polarization Polar
Tan Delta 0.25
Ripple Current @ Low Frequency 6.3A @ 120Hz
Ripple Current @ High Frequency 9.45A @ 10kHz
Diameter 51mm
Height Seated (Max) 3.268 83.00mm
Length 80mm
RoHS StatusROHS3 Compliant
In-Stock:319 items

Pricing & Ordering

QuantityUnit PriceExt. Price
10$26.53000$265.3

About LNT1H223MSEB

The LNT1H223MSEB from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 22000UF 20% 50V SCREW.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LNT1H223MSEB, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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