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LLG2E681MELZ50

LLG2E681MELZ50

LLG2E681MELZ50

Nichicon

Aluminum Electrolytic Capacitors - Snap In 250volts 680uF 85c 22x50x10L/S

SOT-23

LLG2E681MELZ50 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 19 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can - Snap-In
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~85°C
PackagingBulk
Published 2015
Series LLG
Size / Dimension 0.866Dia 22.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Number of Terminations 2
Termination Snap in
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
HTS Code8532.22.00
Capacitance 680μF
Voltage - Rated DC 250V
Lead Pitch 10mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.394 10.00mm
Lifetime @ Temp 2000 Hrs @ 85°C
Leakage Current 1.23mA
Ripple Current2.5A
Polarization Polar
Tan Delta 0.15
Diameter 22mm
Height 50mm
Height Seated (Max) 1.850 47.00mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:2851 items

Pricing & Ordering

QuantityUnit PriceExt. Price
250$2.85376$713.44

About LLG2E681MELZ50

The LLG2E681MELZ50 from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features Aluminum Electrolytic Capacitors - Snap In 250volts 680uF 85c 22x50x10L/S.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LLG2E681MELZ50, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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