Welcome to Hotenda.com Online Store!

logo
userjoin
Home

LGY1E223MELC35

LGY1E223MELC35

LGY1E223MELC35

Nichicon

Aluminum Electrolytic Capacitors - Snap In 25volts 22000uF 105c 35x35x10L/S

SOT-23

LGY1E223MELC35 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 19 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can - Snap-In
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~105°C
PackagingBulk
Published 2009
Series LGY
Size / Dimension 1.378Dia 35.00mm
Tolerance ±20%
JESD-609 Code e3
Feature General Purpose
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Snap in
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Voltage - Rated 25V
HTS Code8532.22.00
Capacitance 22000μF
Lead Pitch 10mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.394 10.00mm
Rated (DC) Voltage (URdc) 25V
In-Stock:1347 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$5.67000$5.67
10$5.04200$50.42
100$4.03330$403.33
500$3.46610$1733.05

About LGY1E223MELC35

The LGY1E223MELC35 from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features Aluminum Electrolytic Capacitors - Snap In 25volts 22000uF 105c 35x35x10L/S.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LGY1E223MELC35, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News