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LGN2X560MELB25

LGN2X560MELB25

LGN2X560MELB25

Nichicon

Cap Aluminum 56uF 600V 20% Snap-In Aluminum Cylindrical Can 500mA 2000 hr 105°C Bulk

SOT-23

LGN2X560MELB25 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can - Snap-In
Dielectric MaterialALUMINUM (WET)
Operating Temperature-25°C~105°C
PackagingBulk
Published 2015
Series LGN
Size / Dimension 1.181Dia 30.00mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Applications General Purpose
Voltage - Rated 600V
Capacitance 56μF
Lead Pitch 10.0076mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.394 10.00mm
Lifetime @ Temp 2000 Hrs @ 105°C
Ripple Current500mA
Polarization Polar
Life (Hours) 2000 hours
Ripple Current @ Low Frequency 500mA @ 120Hz
Height Seated (Max) 1.063 27.00mm
RoHS StatusROHS3 Compliant
In-Stock:1821 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$4.99000$4.99
10$4.49500$44.95
100$3.39640$339.64
500$2.79706$1398.53

About LGN2X560MELB25

The LGN2X560MELB25 from Nichicon is a high-performance microcontroller designed for a wide range of embedded applications. This component features Cap Aluminum 56uF 600V 20% Snap-In Aluminum Cylindrical Can 500mA 2000 hr 105°C Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LGN2X560MELB25, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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