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HC1S60F1020BM

HC1S60F1020BM

HC1S60F1020BM

Intel

FPGAs Stratix? HardCopy? Series 1020-BBGA

SOT-23

HC1S60F1020BM Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1020-BBGA
Supplier Device Package 1020-FBGA (33x33)
PackagingTray
Series Stratix® HardCopy®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.425V~1.575V
Number of I/O 782
Number of Logic Elements/Cells 57120
Total RAM Bits 5215104
Number of LABs/CLBs 5712
RoHS StatusNon-RoHS Compliant
In-Stock:2546 items

HC1S60F1020BM Product Details

HC1S60F1020BM Overview


There are two packages that contain fpga chips: 1020-BBGA package and X package. Fpga chips is programmed wFpga chipsh 782 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 57120 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. There is a 1.425V~1.575V-volt supply voltage required for the device to operate. As part of the Stratix? HardCopy? series of FPGAs, it is a type of FPGA. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 5215104 bFpga chipss. A total of 5712 LABs/CLBs make up this FPGA array. There is a device package provided by 1020-FBGA (33x33) as its supplier.

HC1S60F1020BM Features


782 I/Os
Up to 5215104 RAM bits

HC1S60F1020BM Applications


There are a lot of Intel HC1S60F1020BM FPGAs applications.

  • Medical Applications
  • Consumer Electronics
  • Random logic
  • Data Center
  • Space Applications
  • Telecommunication
  • Solar Energy
  • Development Boards and Shields for Microcontrollers
  • Aerospace and Defense
  • Secure Communication

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