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HC1S30F780NAE

HC1S30F780NAE

HC1S30F780NAE

Intel

FPGAs Stratix? HardCopy? Series 780-BBGA, FCBGA

SOT-23

HC1S30F780NAE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
PackagingTray
Series Stratix® HardCopy®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.425V~1.575V
Number of I/O 597
Number of Logic Elements/Cells 32470
Total RAM Bits 2137536
Number of LABs/CLBs 3247
RoHS StatusNon-RoHS Compliant
In-Stock:3509 items

HC1S30F780NAE Product Details

HC1S30F780NAE Overview


This package is included in the 780-BBGA, FCBGA package and is available for purchase. Fpga chips is programmed wFpga chipsh 597 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 32470 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.425V~1.575V. FPGAs belonging to the Stratix? HardCopy? series are a type of FPGA that belong to the Stratix? HardCopy? series of FPGAs. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. A device like this one offers 2137536 RAM bits, which is a considerable amount of memory. The FPGA is built as an array of 3247 latches or CLBs. Device package 780-FBGA (29x29) is provided by its supplier.

HC1S30F780NAE Features


597 I/Os
Up to 2137536 RAM bits

HC1S30F780NAE Applications


There are a lot of Intel HC1S30F780NAE FPGAs applications.

  • Artificial intelligence (AI)
  • Space Applications
  • Electronic Warfare
  • Industrial Ethernet
  • ADAS
  • Industrial IoT
  • Integrating multiple SPLDs
  • Software-defined radios
  • Defense Applications
  • Wired Communications

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