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H2F0.79BK25

H2F0.79BK25

H2F0.79BK25

Techflex

2:1 FAB HEATSHRINK BLK 20MM 25'

SOT-23

H2F0.79BK25 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Series Shrinkflex
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Color Black
Shrinkage Ratio 2 to 1
Length 25.00' 7.62m
Diameter - Inner, Supplied 0.79 (20.1mm)
Diameter - Inner, Recovered 0.39 (9.9mm)
RoHS StatusROHS3 Compliant
In-Stock:206 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$44.086359$44.086359
10$41.590905$415.90905
100$39.236703$3923.6703
500$37.015758$18507.879
1000$34.920526$34920.526

About H2F0.79BK25

The H2F0.79BK25 from Techflex is a high-performance microcontroller designed for a wide range of embedded applications. This component features 2:1 FAB HEATSHRINK BLK 20MM 25'.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H2F0.79BK25, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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