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EPF8820QC160-4

EPF8820QC160-4

EPF8820QC160-4

Intel

FPGAs FLEX 8000 Series 160-BQFP

SOT-23

EPF8820QC160-4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 160-BQFP
Supplier Device Package 160-PQFP (28x28)
Operating Temperature0°C~70°C TA
PackagingTray
Series FLEX 8000
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.75V~5.25V
Number of I/O 120
Number of Logic Elements/Cells 672
Number of Gates8000
Number of LABs/CLBs 84
In-Stock:2347 items

EPF8820QC160-4 Product Details

EPF8820QC160-4 Overview


There are two packages that contain fpga chips: 160-BQFP package and X package. The I/Os are designed to facilitate a more coherent transfer of data. To form a fundamental building block, there are 672 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. In order for it to operate, the supply voltage must be 4.75V~5.25V . FPGAs belonging to the FLEX 8000 series are a type of FPGA that belong to the FLEX 8000 series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~70°C TA range. In order to save space, this FPGA model has been contained in Tray. Fpga electronics contains 84 LABs/CLBs in an array. A basic building block for this type of building block consists of 8000 gates. 160-PQFP (28x28) stands for its supplier device package.

EPF8820QC160-4 Features


120 I/Os

EPF8820QC160-4 Applications


There are a lot of Intel EPF8820QC160-4 FPGAs applications.

  • Security systems
  • Data center search engines
  • Aircraft navigation
  • Voice recognition
  • Industrial IoT
  • Computer hardware emulation
  • Automotive Applications
  • Server Applications
  • Military DSP
  • Automotive advanced driver assistance systems (ADAS)

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