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EPF8452AQC160-3AC

EPF8452AQC160-3AC

EPF8452AQC160-3AC

Intel

FPGAs FLEX 8000 Series 160-BQFP

SOT-23

EPF8452AQC160-3AC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 160-BQFP
Supplier Device Package 160-PQFP (28x28)
Operating Temperature0°C~70°C TA
PackagingTray
Series FLEX 8000
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.75V~5.25V
Number of I/O 120
Number of Logic Elements/Cells 336
Number of Gates4000
Number of LABs/CLBs 42
In-Stock:1994 items

EPF8452AQC160-3AC Product Details

EPF8452AQC160-3AC Overview


This package is included in the 160-BQFP package and is available for purchase. Its 120 I/Os help it transfer data more efficiently. A fundamental building block contains 336 logic elements or cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 4.75V~5.25V , at which it runs. An FPGA belonging to the FLEX 8000 series is referred to as an FPGA. The operating temperature should be kept at 0°C~70°C TA when operating. There is an FPGA model contained in Tray in order to conserve space. Fpga electronics contains 42 LABs/CLBs in an array. Fpga semiconductor is made up of 4000 gates as fpga semiconductors basic building block. This device package is supplied by 160-PQFP (28x28).

EPF8452AQC160-3AC Features


120 I/Os

EPF8452AQC160-3AC Applications


There are a lot of Intel EPF8452AQC160-3AC FPGAs applications.

  • Broadcast
  • Telecommunication
  • Artificial intelligence (AI)
  • Camera time adjustments
  • Secure Communication
  • Wired Communications
  • Digital signal processing
  • Integrating multiple SPLDs
  • OpenCL
  • Security systems

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