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EPF8282ATI100-3NGZ

EPF8282ATI100-3NGZ

EPF8282ATI100-3NGZ

Intel

FPGAs FLEX 8000 Series 100-TQFP

SOT-23

EPF8282ATI100-3NGZ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 100-TQFP
Supplier Device Package 100-TQFP (14x14)
Operating Temperature-40°C~85°C TA
PackagingTray
Series FLEX 8000
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.75V~5.25V
Number of I/O 78
Number of Logic Elements/Cells 208
Number of Gates2500
Number of LABs/CLBs 26
In-Stock:1320 items

EPF8282ATI100-3NGZ Product Details

EPF8282ATI100-3NGZ Overview


In the package 100-TQFP, this product is provided. A total of 78 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 208 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 4.75V~5.25V, this device operates with ease. This is a type of FPGA that is part of the FLEX 8000 series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~85°C TA when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. The FPGA is built as an array of 26 latches or CLBs. A basic building block for this type of building block consists of 2500 gates. As a supplier, 100-TQFP (14x14) is responsible for the package of its devices.

EPF8282ATI100-3NGZ Features


78 I/Os


EPF8282ATI100-3NGZ Applications


There are a lot of Intel
EPF8282ATI100-3NGZ FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center

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