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EPF10K30A3NTI144-3

EPF10K30A3NTI144-3

EPF10K30A3NTI144-3

Intel

FPGAs FLEX-10KA? Series 144-LQFP

SOT-23

EPF10K30A3NTI144-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Operating Temperature-40°C~85°C TA
PackagingTray
Series FLEX-10KA®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3V~3.6V
Number of I/O 102
Number of Logic Elements/Cells 1728
Total RAM Bits 12288
Number of Gates69000
Number of LABs/CLBs 216
In-Stock:4294 items

EPF10K30A3NTI144-3 Product Details

EPF10K30A3NTI144-3 Overview


There is a 144-LQFP package that includes this component. Its 102 I/Os help it transfer data more efficiently. There are 1728 logic elements/cells to form a fundamental building block. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates wFpga chipsh a supply voltage of 3V~3.6V. The FPGA belongs to the FLEX-10KA? series of FPGAs, and it is one type of FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~85°C TA when operating the machine. In order to save space, this FPGA model has been contained in Tray. The RAM bits that are offered by this fpga chips are 12288. The FPGA is built as an array of 216 latches or CLBs. 69000 gates make up the basic block of its construction. The supplier of the device package is 144-TQFP (20x20).

EPF10K30A3NTI144-3 Features


102 I/Os
Up to 12288 RAM bits

EPF10K30A3NTI144-3 Applications


There are a lot of Intel EPF10K30A3NTI144-3 FPGAs applications.

  • Solar Energy
  • Consumer Electronics
  • Wired Communications
  • ASIC prototyping
  • Medical imaging
  • ADAS
  • Voice recognition
  • Digital signal processing
  • Aircraft navigation
  • Development Boards and Shields for Microcontrollers

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