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EPF10K200SBC600-3B

EPF10K200SBC600-3B

EPF10K200SBC600-3B

Intel

FPGAs FLEX-10KS? Series 600-BGA

SOT-23

EPF10K200SBC600-3B Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 600-BGA
Supplier Device Package 600-BGA (45x45)
Operating Temperature0°C~70°C TA
PackagingTray
Series FLEX-10KS®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 470
Number of Logic Elements/Cells 9984
Total RAM Bits 98304
Number of Gates513000
Number of LABs/CLBs 1248
In-Stock:4122 items

EPF10K200SBC600-3B Product Details

EPF10K200SBC600-3B Overview


A 600-BGA package is provided with this component. Having 470 I/Os makes data transfers more coherent. A fundamental building block is made up of 9984 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. The supply voltage of the device is 2.375V~2.625V , at which it runs. An FPGA belonging to the FLEX-10KS? series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~70°C TA at all times. There is an FPGA model contained in Tray in order to conserve space. This device is equipped with 98304 RAM bits in terms of its RAM si98304e. 1248 LABs/CLBs are integrated into this FPGA. 513000 gates make up the basic block of its construction. Device package 600-BGA (45x45) is provided by its supplier.

EPF10K200SBC600-3B Features


470 I/Os
Up to 98304 RAM bits

EPF10K200SBC600-3B Applications


There are a lot of Intel EPF10K200SBC600-3B FPGAs applications.

  • Automotive advanced driver assistance systems (ADAS)
  • Wired Communications
  • Filtering and communication encoding
  • Computer hardware emulation
  • Medical Electronics
  • Telecommunication
  • Voice recognition
  • DO-254
  • Integrating multiple SPLDs
  • Security systems

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