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EPF10K100EFI484-3N

EPF10K100EFI484-3N

EPF10K100EFI484-3N

Intel

FPGAs FLEX-10KE? Series 484-BBGA

SOT-23

EPF10K100EFI484-3N Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Operating Temperature-40°C~85°C TA
PackagingTray
Series FLEX-10KE®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 338
Number of Logic Elements/Cells 4992
Total RAM Bits 49152
Number of Gates257000
Number of LABs/CLBs 624
In-Stock:2527 items

EPF10K100EFI484-3N Product Details

EPF10K100EFI484-3N Overview


As part of the 484-BBGA package, it is included. Its 338 I/Os help it transfer data more efficiently. A fundamental building block consists of 4992 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. There is a 2.375V~2.625V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the FLEX-10KE? seies. The operating temperature should be kept at -40°C~85°C TA when operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. A device like this one offers 49152 RAM bits, which is a considerable amount of memory. The FPGA consists of 624 LABs/CLBs. As a basic building block, fpga semiconductor consists of 257000 gates. The device package supplied by 484-FBGA (23x23) is one of its suppliers.

EPF10K100EFI484-3N Features


338 I/Os
Up to 49152 RAM bits

EPF10K100EFI484-3N Applications


There are a lot of Intel EPF10K100EFI484-3N FPGAs applications.

  • Broadcast
  • Distributed Monetary Systems
  • Software-defined radios
  • Digital signal processing
  • Artificial intelligence (AI)
  • Computer hardware emulation
  • Data Center
  • Cryptography
  • Device controllers
  • Video & Image Processing

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