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EPF10K100EFC256-2AA

EPF10K100EFC256-2AA

EPF10K100EFC256-2AA

Intel

FPGAs FLEX-10KE? Series 256-BGA

SOT-23

EPF10K100EFC256-2AA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Operating Temperature0°C~70°C TA
PackagingTray
Series FLEX-10KE®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 191
Number of Logic Elements/Cells 4992
Total RAM Bits 49152
Number of Gates257000
Number of LABs/CLBs 624
In-Stock:1900 items

EPF10K100EFC256-2AA Product Details

EPF10K100EFC256-2AA Overview


There are two packages that contain fpga chips: 256-BGA package and X package. The device has 191 I/O ports for more coherent data transfer. A fundamental building block consists of 4992 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. With a supply voltage of 2.375V~2.625V, this device operates with ease. There are many types of FPGAs in the FLEX-10KE? series, this is one of them. The operating temperature should be kept at 0°C~70°C TA when operating. In order to save space, this FPGA model has been contained in Tray. As far as the RAM bits are concerned, this device offers you a total of 49152. An array of 624 LABs/CLBs is built into the FPGA. 257000 gates make up the basic block of its construction. There is a device package provided by 256-FBGA (17x17), which is the supplier.

EPF10K100EFC256-2AA Features


191 I/Os
Up to 49152 RAM bits

EPF10K100EFC256-2AA Applications


There are a lot of Intel EPF10K100EFC256-2AA FPGAs applications.

  • Aerospace and Defense
  • Scientific Instruments
  • Software-defined radio
  • DO-254
  • Solar Energy
  • Security systems
  • Camera time adjustments
  • Industrial IoT
  • Military DSP
  • ASIC prototyping

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