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EP4SGX70HF35C2G

EP4SGX70HF35C2G

EP4SGX70HF35C2G

Intel

3.5mm mm FPGAs Stratix? IV GX Series 1152-BBGA, FCBGA 1mm mm

SOT-23

EP4SGX70HF35C2G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingTray
Series Stratix® IV GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1152
Number of I/O 488
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 72600
Total RAM Bits 7564880
Number of LABs/CLBs 2904
Height Seated (Max) 3.5mm
Length 35mm
Width 35mm
RoHS StatusRoHS Compliant
In-Stock:1267 items

Pricing & Ordering

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EP4SGX70HF35C2G Product Details

EP4SGX70HF35C2G Overview


In the package 1152-BBGA, FCBGA, this product is provided. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 72600 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. Powered by a 0.87V~0.93V supply voltage, fpga chips is able to operate at high speeds. There are many types of FPGAs in the Stratix? IV GX series, this is one of them. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that are offered by this fpga chips are 7564880. The FPGA consists of 2904 LABs/CLBs.

EP4SGX70HF35C2G Features


488 I/Os
Up to 7564880 RAM bits

EP4SGX70HF35C2G Applications


There are a lot of Intel EP4SGX70HF35C2G FPGAs applications.

  • Telecommunication
  • Data Mining
  • Artificial intelligence (AI)
  • Medical ultrasounds
  • High Performance Computing
  • Cryptography
  • Ecosystem
  • Distributed Monetary Systems
  • OpenCL
  • Consumer Electronics

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