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EP4SGX70DF29C3G

EP4SGX70DF29C3G

EP4SGX70DF29C3G

Intel

FPGAs Stratix? IV GX Series 780-BBGA, FCBGA

SOT-23

EP4SGX70DF29C3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Operating Temperature0°C~85°C TJ
PackagingTray
Series Stratix® IV GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Base Part Number EP4SGX70
Number of I/O 372
Number of Logic Elements/Cells 72600
Total RAM Bits 7564880
Number of LABs/CLBs 2904
RoHS StatusRoHS Compliant
In-Stock:3971 items

Pricing & Ordering

QuantityUnit PriceExt. Price

EP4SGX70DF29C3G Product Details

EP4SGX70DF29C3G Overview


Fpga chips is supplied in the 780-BBGA, FCBGA package. A total of 372 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 72600 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates at a voltage of 0.87V~0.93V and uses a battery to supply power. As part of the Stratix? IV GX series of FPGAs, it is a type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 7564880 bFpga chipss. EP4SGX70 is the base part number that can be used to identify related parts. This FPGA is built as an array of 2904 LABs/CLBs.

EP4SGX70DF29C3G Features


372 I/Os
Up to 7564880 RAM bits

EP4SGX70DF29C3G Applications


There are a lot of Intel EP4SGX70DF29C3G FPGAs applications.

  • Security systems
  • Broadcast
  • Medical imaging
  • Industrial,Medical and Scientific Instruments
  • Voice recognition
  • Cryptography
  • Computer hardware emulation
  • Bioinformatics
  • Aircraft navigation
  • Military Temperature

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