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EP4CGX15BN11C8N

EP4CGX15BN11C8N

EP4CGX15BN11C8N

Intel

FPGAs Cyclone? IV GX Series 148-WFQFN Dual Rows, Exposed Pad

SOT-23

EP4CGX15BN11C8N Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 148-WFQFN Dual Rows, Exposed Pad
Supplier Device Package 148-QFN (11x11)
Operating Temperature0°C~85°C TJ
PackagingTray
Series Cyclone® IV GX
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.16V~1.24V
Base Part Number EP4CGX15
Number of I/O 72
Number of Logic Elements/Cells 14400
Total RAM Bits 552960
Number of LABs/CLBs 900
In-Stock:2024 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$40.856422$40.856422
10$38.543795$385.43795
100$36.362071$3636.2071
500$34.303840$17151.92
1000$32.362113$32362.113

EP4CGX15BN11C8N Product Details

EP4CGX15BN11C8N Overview


As part of the 148-WFQFN Dual Rows, Exposed Pad package, it is included. 72 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 1.16V~1.24V battery. It is a type of FPGA that belongs to the Cyclone? IV GX series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A model of this FPGA is contained in Tray for the purpose of saving space. A device like this one offers 552960 RAM bits, which is a considerable amount of memory. Its base part number EP4CGX15 can be used to find related parts. Fpga electronics contains 900 LABs/CLBs in an array. The device package supplied by 148-QFN (11x11) is one of its suppliers.

EP4CGX15BN11C8N Features


72 I/Os
Up to 552960 RAM bits

EP4CGX15BN11C8N Applications


There are a lot of Intel EP4CGX15BN11C8N FPGAs applications.

  • OpenCL
  • Audio
  • Data center search engines
  • High Performance Computing
  • Medical Electronics
  • Automation
  • Telecommunication
  • Military DSP
  • ASIC prototyping
  • Integrating multiple SPLDs

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