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EP3SL70F780C3NAC

EP3SL70F780C3NAC

EP3SL70F780C3NAC

Intel

FPGAs Stratix? III L Series 780-BBGA, FCBGA

SOT-23

EP3SL70F780C3NAC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature0°C~85°C TJ
Series Stratix® III L
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 488
Number of Logic Elements/Cells 67500
Total RAM Bits 2699264
Number of LABs/CLBs 2700
In-Stock:2555 items

EP3SL70F780C3NAC Product Details

EP3SL70F780C3NAC Overview


Fpga chips is supplied in the 780-BBGA, FCBGA package. A total of 488 I/Os allow data to be transferred in a more coherent manner. Logic blocks consist of 67500 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. There is a 0.86V~1.15V-volt supply voltage required for the device to operate. The Stratix? III L series FPGA is a type of FPGA that belongs to the Stratix? III L family of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. The RAM bits that this device offer is 2699264. The FPGA consists of 2700 LABs/CLBs. As a supplier, 780-FBGA (29x29) is responsible for the package of its devices.

EP3SL70F780C3NAC Features


488 I/Os
Up to 2699264 RAM bits

EP3SL70F780C3NAC Applications


There are a lot of Intel EP3SL70F780C3NAC FPGAs applications.

  • DO-254
  • Computer hardware emulation
  • Medical ultrasounds
  • Wireless Communications
  • Solar Energy
  • High Performance Computing
  • ASIC prototyping
  • Data Center
  • Aircraft navigation
  • Enterprise networking

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