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EP3SL70F780C2G

EP3SL70F780C2G

EP3SL70F780C2G

Intel

FPGAs Stratix? III L Series 780-BBGA, FCBGA

SOT-23

EP3SL70F780C2G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Operating Temperature0°C~85°C TJ
Series Stratix® III L
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 488
Number of Logic Elements/Cells 67500
Total RAM Bits 2699264
Number of LABs/CLBs 2700
RoHS StatusRoHS Compliant
In-Stock:2169 items

EP3SL70F780C2G Product Details

EP3SL70F780C2G Overview


There are two packages that contain fpga chips: 780-BBGA, FCBGA package and X package. A total of 488 I/Os allow data to be transferred in a more coherent manner. In order to construct a fundamental building block, 67500 logic elements/cells are required. By attaching the Surface Mount connector, you can use this FPGA module with your development board. In order for it to operate, the supply voltage must be 0.86V~1.15V . The FPGA belongs to the Stratix? III L series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. A device like this one offers 2699264 RAM bits, which is a considerable amount of memory. An array of 2700 LABs/CLBs is built into the FPGA.

EP3SL70F780C2G Features


488 I/Os
Up to 2699264 RAM bits

EP3SL70F780C2G Applications


There are a lot of Intel EP3SL70F780C2G FPGAs applications.

  • Development Boards and Shields for Microcontrollers
  • Secure Communication
  • Video & Image Processing
  • Computer hardware emulation
  • Software-defined radio
  • Voice recognition
  • Medical Electronics
  • Audio
  • Cryptography
  • Software-defined radios

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