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EP3SE50F780I4LG

EP3SE50F780I4LG

EP3SE50F780I4LG

Intel

FPGAs Stratix? III E Series 780-BBGA, FCBGA

SOT-23

EP3SE50F780I4LG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature-40°C~100°C TJ
Series Stratix® III E
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 488
Number of Logic Elements/Cells 47500
Total RAM Bits 5760000
Number of LABs/CLBs 1900
RoHS StatusRoHS Compliant
In-Stock:4224 items

EP3SE50F780I4LG Product Details

EP3SE50F780I4LG Overview


This package is included in the 780-BBGA, FCBGA package and is available for purchase. Fpga chips is programmed wFpga chipsh 488 I/Os for transferring data in a more coherent manner. Logic elements/cells form the fundamental building block of a computer. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 0.86V~1.15V. FPGAs belonging to the Stratix? III E series are a type of FPGA that belong to the Stratix? III E series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. As far as the RAM bits are concerned, this device offers you a total of 5760000. The FPGA is built as an array of 1900 latches or CLBs. There is a device package provided by 780-FBGA (29x29), which is the supplier.

EP3SE50F780I4LG Features


488 I/Os
Up to 5760000 RAM bits

EP3SE50F780I4LG Applications


There are a lot of Intel EP3SE50F780I4LG FPGAs applications.

  • Audio
  • Wireless Communications
  • Image processing
  • Medical Applications
  • Aircraft navigation
  • Server Applications
  • Automotive Applications
  • Broadcast
  • Distributed Monetary Systems
  • Military Temperature

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