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EP3SE50F780I3G

EP3SE50F780I3G

EP3SE50F780I3G

Intel

FPGAs Stratix? III E Series 780-BBGA, FCBGA

SOT-23

EP3SE50F780I3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 26 Weeks
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Stratix® III E
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 488
Number of Logic Elements/Cells 47500
Total RAM Bits 5760000
Number of LABs/CLBs 1900
RoHS StatusRoHS Compliant
In-Stock:2864 items

Pricing & Ordering

QuantityUnit PriceExt. Price

EP3SE50F780I3G Product Details

EP3SE50F780I3G Overview


This package is included in the 780-BBGA, FCBGA package and is available for purchase. The device has 488 I/O ports for more coherent data transfer. In order to construct a fundamental building block, 47500 logic elements/cells are required. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 0.86V~1.15V. It is a type of FPGA that belongs to the Stratix? III E series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. As a result of space limitations, this FPGA model has been included in Tray. This device is equipped with 5760000 RAM bits in terms of its RAM si5760000e. An array of 1900 LABs/CLBs is built into the FPGA.

EP3SE50F780I3G Features


488 I/Os
Up to 5760000 RAM bits

EP3SE50F780I3G Applications


There are a lot of Intel EP3SE50F780I3G FPGAs applications.

  • Industrial Ethernet
  • Software-defined radio
  • Integrating multiple SPLDs
  • Wireless Communications
  • OpenCL
  • Computer hardware emulation
  • Telecommunication
  • Bioinformatics
  • Cryptography
  • Video & Image Processing

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