EP3SE50F484C3G Overview
In the 484-BBGA, FCBGA package, you will find fpga chips. This device features 296 I/Os in order to transfer data in a more efficient manner. A fundamental building block contains 47500 logic elements or cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 0.86V~1.15V battery. The Stratix? III E series FPGA is a type of FPGA that belongs to the Stratix? III E family of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. Fpga electronics is worth mentioning that this device provides 5760000 bfpga electronics s of RAM. The FPGA consists of 1900 LABs/CLBs. The device package supplied by 484-FBGA (23x23) is one of its suppliers.
EP3SE50F484C3G Features
296 I/Os
Up to 5760000 RAM bits
EP3SE50F484C3G Applications
There are a lot of Intel EP3SE50F484C3G FPGAs applications.
- Wired Communications
- Device controllers
- Data Center
- Video & Image Processing
- Audio
- Industrial IoT
- Aircraft navigation
- Telecommunication
- Wireless Communications
- DO-254
