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EP3SE50F484C2G

EP3SE50F484C2G

EP3SE50F484C2G

Intel

FPGAs Stratix? III E Series 484-BBGA, FCBGA

SOT-23

EP3SE50F484C2G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 26 Weeks
Mounting Type Surface Mount
Package / Case 484-BBGA, FCBGA
Operating Temperature0°C~85°C TJ
PackagingTray
Series Stratix® III E
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 296
Number of Logic Elements/Cells 47500
Total RAM Bits 5760000
Number of LABs/CLBs 1900
RoHS StatusRoHS Compliant
In-Stock:4425 items

Pricing & Ordering

QuantityUnit PriceExt. Price

EP3SE50F484C2G Product Details

EP3SE50F484C2G Overview


This package is included in the 484-BBGA, FCBGA package and is available for purchase. Fpga chips is programmed wFpga chipsh 296 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 47500 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 0.86V~1.15V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the Stratix? III E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. A device like this one offers 5760000 RAM bits, which is a considerable amount of memory. Fpga electronics contains 1900 LABs/CLBs in an array.

EP3SE50F484C2G Features


296 I/Os
Up to 5760000 RAM bits

EP3SE50F484C2G Applications


There are a lot of Intel EP3SE50F484C2G FPGAs applications.

  • Electronic Warfare
  • Automotive driver's assistance
  • ASIC prototyping
  • Server Applications
  • Telecommunication
  • Integrating multiple SPLDs
  • Military Temperature
  • Security systems
  • Medical imaging
  • Video & Image Processing

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