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EP2AGX95EF35I3

EP2AGX95EF35I3

EP2AGX95EF35I3

Intel

FPGAs Arria II GX Series 1152-BBGA, FCBGA

SOT-23

EP2AGX95EF35I3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria II GX
JESD-609 Code e0
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN LEAD
Voltage - Supply 0.87V~0.93V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number EP2AGX95
Number of I/O 452
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 89178
Total RAM Bits 6839296
Number of LABs/CLBs 3747
RoHS StatusNon-RoHS Compliant
In-Stock:4365 items

EP2AGX95EF35I3 Product Details

EP2AGX95EF35I3 Overview


This package is included in the 1152-BBGA, FCBGA package and is available for purchase. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Its 452 I/Os help it transfer data more efficiently. A fundamental building block consists of 89178 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.87V~0.93V supply voltage, fpga chips is able to operate at high speeds. FPGAs belonging to the Arria II GX series are a type of FPGA that belong to the Arria II GX series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that are offered by this fpga chips are 6839296. If you are looking for related parts, you can use the base part number EP2AGX95 as a starting point. A total of 3747 LABs/CLBs make up this FPGA array.

EP2AGX95EF35I3 Features


452 I/Os
Up to 6839296 RAM bits

EP2AGX95EF35I3 Applications


There are a lot of Intel EP2AGX95EF35I3 FPGAs applications.

  • Digital signal processing
  • Data Center
  • Automotive driver's assistance
  • Development Boards and Shields for Microcontrollers
  • Integrating multiple SPLDs
  • Military Temperature
  • Telecommunication
  • Industrial Ethernet
  • ADAS
  • Distributed Monetary Systems

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