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EP2AGX95DF25I3

EP2AGX95DF25I3

EP2AGX95DF25I3

Intel

FPGAs Arria II GX Series 572-BGA, FCBGA

SOT-23

EP2AGX95DF25I3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 572-BGA, FCBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria II GX
JESD-609 Code e0
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN LEAD
Voltage - Supply 0.87V~0.93V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number EP2AGX95
Number of I/O 260
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 89178
Total RAM Bits 6839296
Number of LABs/CLBs 3747
RoHS StatusNon-RoHS Compliant
In-Stock:4865 items

EP2AGX95DF25I3 Product Details

EP2AGX95DF25I3 Overview


This package is included in the 572-BGA, FCBGA package and is available for purchase. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The device has 260 I/O ports for more coherent data transfer. The basic building blocks of logic contain 89178 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. A supply voltage of 0.87V~0.93V is needed in order for fpga chips to operate. As part of the Arria II GX series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 6839296 bFpga chipss. EP2AGX95 is the base part number that can be used to identify related parts. 3747 LABs and CLBs are built into this FPGA.

EP2AGX95DF25I3 Features


260 I/Os
Up to 6839296 RAM bits

EP2AGX95DF25I3 Applications


There are a lot of Intel EP2AGX95DF25I3 FPGAs applications.

  • Military Temperature
  • Scientific Instruments
  • Industrial Ethernet
  • Integrating multiple SPLDs
  • Data center search engines
  • Data Mining
  • Distributed Monetary Systems
  • ASIC prototyping
  • Automotive driver's assistance
  • Secure Communication

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