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EP2AGX65DF25C6G

EP2AGX65DF25C6G

EP2AGX65DF25C6G

Intel

FPGAs Arria II GX Series 572-BGA, FCBGA

SOT-23

EP2AGX65DF25C6G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 572-BGA, FCBGA
Operating Temperature0°C~85°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 252
Number of Logic Elements/Cells 60214
Total RAM Bits 5371904
Number of LABs/CLBs 2530
RoHS StatusRoHS Compliant
In-Stock:1674 items

EP2AGX65DF25C6G Product Details

EP2AGX65DF25C6G Overview


There are two packages that contain fpga chips: 572-BGA, FCBGA package and X package. This device features 252 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 60214 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. There is a 0.87V~0.93V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the Arria II GX series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. The RAM bits that this device offer is 5371904. 2530 LABs/CLBs are integrated into this FPGA.

EP2AGX65DF25C6G Features


252 I/Os
Up to 5371904 RAM bits

EP2AGX65DF25C6G Applications


There are a lot of Intel EP2AGX65DF25C6G FPGAs applications.

  • ASIC prototyping
  • ADAS
  • Radar and Sensors
  • Software-defined radio
  • High Performance Computing
  • Video & Image Processing
  • Software-defined radios
  • OpenCL
  • Cryptography
  • Artificial intelligence (AI)

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