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EP2AGX65CU17I5G

EP2AGX65CU17I5G

EP2AGX65CU17I5G

Intel

FPGAs Arria II GX Series 358-LFBGA, FCBGA

SOT-23

EP2AGX65CU17I5G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 358-LFBGA, FCBGA
Operating Temperature-40°C~100°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 156
Number of Logic Elements/Cells 60214
Total RAM Bits 5371904
Number of LABs/CLBs 2530
RoHS StatusRoHS Compliant
In-Stock:1720 items

EP2AGX65CU17I5G Product Details

EP2AGX65CU17I5G Overview


There are two packages that contain fpga chips: 358-LFBGA, FCBGA package and X package. Its 156 I/Os help it transfer data more efficiently. In order to construct a fundamental building block, 60214 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. There is a 0.87V~0.93V-volt supply voltage required for the device to operate. The Arria II GX Series is one of the types of FPGAs that belong to this type. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. This device is equipped with 5371904 RAM bits in terms of its RAM si5371904e. The FPGA is built as an array of 2530 latches or CLBs.

EP2AGX65CU17I5G Features


156 I/Os
Up to 5371904 RAM bits

EP2AGX65CU17I5G Applications


There are a lot of Intel EP2AGX65CU17I5G FPGAs applications.

  • Enterprise networking
  • Data center search engines
  • Filtering and communication encoding
  • Device controllers
  • Radar and Sensors
  • Development Boards and Shields for Microcontrollers
  • Industrial Ethernet
  • Space Applications
  • Ecosystem
  • Wired Communications

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