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EP2AGX45DF29I5G

EP2AGX45DF29I5G

EP2AGX45DF29I5G

Intel

FPGAs Arria II GX Series 780-BBGA, FCBGA

SOT-23

EP2AGX45DF29I5G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature-40°C~100°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 364
Number of Logic Elements/Cells 42959
Total RAM Bits 3517440
Number of LABs/CLBs 1805
RoHS StatusRoHS Compliant
In-Stock:1524 items

EP2AGX45DF29I5G Product Details

EP2AGX45DF29I5G Overview


There are two packages that contain fpga chips: 780-BBGA, FCBGA package and X package. 364 I/Os are available for transferring data more efficiently. In order to construct a fundamental building block, 42959 logic elements/cells are required. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.87V~0.93V. This is a type of FPGA that is part of the Arria II GX series of FPGAs. The operating temperature should be kept at -40°C~100°C TJ when operating. Having a RAM bit size of 3517440 means that this device will offer you a lot of memory. 1805 LABs/CLBs are configured on this FPGA. 780-FBGA (29x29) stands for its supplier device package.

EP2AGX45DF29I5G Features


364 I/Os
Up to 3517440 RAM bits

EP2AGX45DF29I5G Applications


There are a lot of Intel EP2AGX45DF29I5G FPGAs applications.

  • Automotive Applications
  • Medical imaging
  • Electronic Warfare
  • Wireless Communications
  • Data center search engines
  • High Performance Computing
  • Distributed Monetary Systems
  • Industrial,Medical and Scientific Instruments
  • Industrial Ethernet
  • Embedded Vision

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