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EP2AGX45DF29I3NAC

EP2AGX45DF29I3NAC

EP2AGX45DF29I3NAC

Intel

FPGAs Arria II GX Series 780-BBGA, FCBGA

SOT-23

EP2AGX45DF29I3NAC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature-40°C~100°C TJ
Series Arria II GX
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 364
Number of Logic Elements/Cells 42959
Total RAM Bits 3517440
Number of LABs/CLBs 1805
In-Stock:1609 items

EP2AGX45DF29I3NAC Product Details

EP2AGX45DF29I3NAC Overview


In the package 780-BBGA, FCBGA, this product is provided. 364 I/Os are available for transferring data more efficiently. Logic blocks consist of 42959 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. This device is powered by a 0.87V~0.93V battery. FPGAs belonging to the Arria II GX series are a type of FPGA that belong to the Arria II GX series of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Fpga electronics is worth mentioning that this device provides 3517440 bfpga electronics s of RAM. A total of 1805 LABs/CLBs make up this FPGA array. 780-FBGA (29x29) stands for its supplier device package.

EP2AGX45DF29I3NAC Features


364 I/Os
Up to 3517440 RAM bits

EP2AGX45DF29I3NAC Applications


There are a lot of Intel EP2AGX45DF29I3NAC FPGAs applications.

  • Data center search engines
  • Audio
  • Data Center
  • Digital signal processing
  • Distributed Monetary Systems
  • Broadcast
  • Defense Applications
  • Industrial IoT
  • OpenCL
  • Military Temperature

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