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EP2AGX45DF25I3G

EP2AGX45DF25I3G

EP2AGX45DF25I3G

Intel

FPGAs Arria II GX Series 572-BGA, FCBGA

SOT-23

EP2AGX45DF25I3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 572-BGA, FCBGA
Operating Temperature-40°C~100°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 252
Number of Logic Elements/Cells 42959
Total RAM Bits 3517440
Number of LABs/CLBs 1805
RoHS StatusRoHS Compliant
In-Stock:4935 items

EP2AGX45DF25I3G Product Details

EP2AGX45DF25I3G Overview


In the 572-BGA, FCBGA package, you will find fpga chips. 252 I/Os are available for transferring data more efficiently. A fundamental building block contains 42959 logic elements or cells. FPGA modules can be attached to development boards using a Surface Mount-connector. Powered by a 0.87V~0.93V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the Arria II GX series is referred to as an FPGA. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. There are 3517440 RAM bits that are available with this device. A total of 1805 LABs/CLBs are included in this FPGA.

EP2AGX45DF25I3G Features


252 I/Os
Up to 3517440 RAM bits

EP2AGX45DF25I3G Applications


There are a lot of Intel EP2AGX45DF25I3G FPGAs applications.

  • Computer hardware emulation
  • Video & Image Processing
  • Radar and Sensors
  • Aerospace and Defense
  • High Performance Computing
  • Distributed Monetary Systems
  • Solar Energy
  • Wireless Communications
  • Device controllers
  • Medical Applications

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