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EP2AGX260EF29C6G

EP2AGX260EF29C6G

EP2AGX260EF29C6G

Intel

FPGAs Arria II GX Series 780-BBGA, FCBGA

SOT-23

EP2AGX260EF29C6G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature0°C~85°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 372
Number of Logic Elements/Cells 244188
Total RAM Bits 12038144
Number of LABs/CLBs 10260
RoHS StatusRoHS Compliant
In-Stock:3828 items

EP2AGX260EF29C6G Product Details

EP2AGX260EF29C6G Overview


As part of the 780-BBGA, FCBGA package, it is included. Having 372 I/Os makes data transfers more coherent. A fundamental building block contains 244188 logic elements or cells. An FPGA module can be attached to a development board with a Surface Mount-pin. In order to operate it, it requires a voltage supply of 0.87V~0.93V . The Arria II GX series FPGA is a type of FPGA that belongs to the Arria II GX family of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. The RAM bits that are offered by this fpga chips are 12038144. The FPGA is built as an array of 10260 latches or CLBs. The supplier of the device package is 780-FBGA (29x29).

EP2AGX260EF29C6G Features


372 I/Os
Up to 12038144 RAM bits

EP2AGX260EF29C6G Applications


There are a lot of Intel EP2AGX260EF29C6G FPGAs applications.

  • Industrial,Medical and Scientific Instruments
  • Military DSP
  • Space Applications
  • ADAS
  • Security systems
  • Cryptography
  • Integrating multiple SPLDs
  • Industrial IoT
  • Telecommunication
  • Data center hardware accelerators

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