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EP2AGX190EF29C4G

EP2AGX190EF29C4G

EP2AGX190EF29C4G

Intel

FPGAs Arria II GX Series 780-BBGA, FCBGA

SOT-23

EP2AGX190EF29C4G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature0°C~85°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 372
Number of Logic Elements/Cells 181165
Total RAM Bits 10177536
Number of LABs/CLBs 7612
RoHS StatusRoHS Compliant
In-Stock:4667 items

EP2AGX190EF29C4G Product Details

EP2AGX190EF29C4G Overview


A 780-BBGA, FCBGA package contains it, and it is available for download. 372 I/Os are available for transferring data more efficiently. A fundamental building block consists of 181165 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. This device is powered by a 0.87V~0.93V battery. The FPGA belongs to the Arria II GX series of FPGAs, and it is one type of FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 10177536 bFpga chipss. Fpga electronics contains 7612 LABs/CLBs in an array. 780-FBGA (29x29) stands for its supplier device package.

EP2AGX190EF29C4G Features


372 I/Os
Up to 10177536 RAM bits

EP2AGX190EF29C4G Applications


There are a lot of Intel EP2AGX190EF29C4G FPGAs applications.

  • Industrial,Medical and Scientific Instruments
  • Device controllers
  • Space Applications
  • Development Boards and Shields for Microcontrollers
  • Broadcast
  • Audio
  • Cryptography
  • Automation
  • Server Applications
  • ASIC prototyping

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