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EP2AGX125EF35I3N

EP2AGX125EF35I3N

EP2AGX125EF35I3N

Intel

2.6mm mm FPGAs Arria II GX Series 1152-BBGA, FCBGA 1mm mm

SOT-23

EP2AGX125EF35I3N Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria II GX
JESD-609 Code e1
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number EP2AGX125
JESD-30 Code S-PBGA-B1152
Number of Outputs 452
Qualification StatusNot Qualified
Power Supplies0.91.2/3.31.52.5V
Number of I/O 452
Clock Frequency 500MHz
Number of Inputs 452
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 118143
Total RAM Bits 8315904
Number of LABs/CLBs 4964
Height Seated (Max) 2.6mm
Length 35mm
Width 35mm
RoHS StatusRoHS Compliant
In-Stock:1900 items

Pricing & Ordering

QuantityUnit PriceExt. Price

EP2AGX125EF35I3N Product Details

EP2AGX125EF35I3N Overview


There are two packages that contain fpga chips: 1152-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 452 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 118143 logic elements/cells. Fpga chips is powered from a supply voltage of 0.9V. Field Programmable Gate Arrays family FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. In order to operate it, it requires a voltage supply of 0.87V~0.93V . As part of the Arria II GX series of FPGAs, it is a type of FPGA. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. During the installation of this device, 452 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. This device has 8315904 RAM bits, which is the number of RAM bits that this device offers. If you are looking for related parts, you can use the base part number EP2AGX125 as a starting point. This FPGA is built as an array of 4964 LABs/CLBs. Power is supplied to the device by a 0.91.2/3.31.52.5V battery. Typically, fpga semiconductor uses a crystal oscillating at 500MHz .

EP2AGX125EF35I3N Features


452 I/Os
Up to 8315904 RAM bits

EP2AGX125EF35I3N Applications


There are a lot of Intel EP2AGX125EF35I3N FPGAs applications.

  • Random logic
  • Distributed Monetary Systems
  • Electronic Warfare
  • Bioinformatics
  • DO-254
  • Ecosystem
  • Enterprise networking
  • Wired Communications
  • Security systems
  • ASIC prototyping

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