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EP2AGX125DF25I5G

EP2AGX125DF25I5G

EP2AGX125DF25I5G

Intel

FPGAs Arria II GX Series 572-BGA, FCBGA

SOT-23

EP2AGX125DF25I5G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 572-BGA, FCBGA
Operating Temperature-40°C~100°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 260
Number of Logic Elements/Cells 118143
Total RAM Bits 8315904
Number of LABs/CLBs 4964
RoHS StatusRoHS Compliant
In-Stock:3291 items

EP2AGX125DF25I5G Product Details

EP2AGX125DF25I5G Overview


In the 572-BGA, FCBGA package, you will find fpga chips. The I/Os are designed to facilitate a more coherent transfer of data. To form a fundamental building block, there are 118143 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 0.87V~0.93V-volt supply voltage required for the device to operate. This is a type of FPGA that is part of the Arria II GX series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. This device is equipped with 8315904 RAM bits in terms of its RAM si8315904e. A total of 4964 LABs/CLBs are included in this FPGA.

EP2AGX125DF25I5G Features


260 I/Os
Up to 8315904 RAM bits

EP2AGX125DF25I5G Applications


There are a lot of Intel EP2AGX125DF25I5G FPGAs applications.

  • Telecommunication
  • Distributed Monetary Systems
  • High Performance Computing
  • ADAS
  • Voice recognition
  • Data center search engines
  • Industrial,Medical and Scientific Instruments
  • Defense Applications
  • Solar Energy
  • Enterprise networking

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