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EP2AGX125DF25I3G

EP2AGX125DF25I3G

EP2AGX125DF25I3G

Intel

FPGAs Arria II GX Series 572-BGA, FCBGA

SOT-23

EP2AGX125DF25I3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 572-BGA, FCBGA
Operating Temperature-40°C~100°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 260
Number of Logic Elements/Cells 118143
Total RAM Bits 8315904
Number of LABs/CLBs 4964
RoHS StatusRoHS Compliant
In-Stock:1075 items

EP2AGX125DF25I3G Product Details

EP2AGX125DF25I3G Overview


In the 572-BGA, FCBGA package, you will find fpga chips. Its 260 I/Os help it transfer data more efficiently. There are 118143 logic elements/cells to form a fundamental building block. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.87V~0.93V-volt supply voltage required for the device to operate. There are many types of FPGAs in the Arria II GX series, this is one of them. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. There are 8315904 RAM bits that are available with this device. Fpga electronics contains 4964 LABs/CLBs in an array.

EP2AGX125DF25I3G Features


260 I/Os
Up to 8315904 RAM bits

EP2AGX125DF25I3G Applications


There are a lot of Intel EP2AGX125DF25I3G FPGAs applications.

  • Solar Energy
  • Software-defined radios
  • Audio
  • Automotive driver's assistance
  • Radar and Sensors
  • Wireless Communications
  • Random logic
  • Scientific Instruments
  • Digital signal processing
  • Filtering and communication encoding

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