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EP2A40F1020C8ES

EP2A40F1020C8ES

EP2A40F1020C8ES

Intel

FPGAs APEX II Series 1020-BBGA

SOT-23

EP2A40F1020C8ES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1020-BBGA
Supplier Device Package 1020-FBGA (33x33)
Operating Temperature0°C~85°C TJ
PackagingTray
Series APEX II
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.425V~1.575V
Number of I/O 735
Number of Logic Elements/Cells 38400
Total RAM Bits 655360
Number of Gates3000000
Number of LABs/CLBs 3840
In-Stock:3108 items

EP2A40F1020C8ES Product Details

EP2A40F1020C8ES Overview


A 1020-BBGA package contains it, and it is available for download. 735 I/Os are available for transferring data more efficiently. In order to construct a fundamental building block, 38400 logic elements/cells are required. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. As part of the APEX II series of FPGAs, it is a type of FPGA. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that this device offer is 655360. 3840 LABs and CLBs are built into this FPGA. The building block that forms the basis of the system contains 3000000 gates. There is a device package provided by 1020-FBGA (33x33), which is the supplier.

EP2A40F1020C8ES Features


735 I/Os
Up to 655360 RAM bits

EP2A40F1020C8ES Applications


There are a lot of Intel EP2A40F1020C8ES FPGAs applications.

  • Industrial IoT
  • Electronic Warfare
  • Artificial intelligence (AI)
  • Wired Communications
  • Filtering and communication encoding
  • Enterprise networking
  • Data Mining
  • Automotive driver's assistance
  • Automation
  • Broadcast

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