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EP2A40B724I8

EP2A40B724I8

EP2A40B724I8

Intel

FPGAs APEX II Series 724-BBGA, FCBGA

SOT-23

EP2A40B724I8 Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 724-BBGA, FCBGA
Supplier Device Package 724-BGA (35x35)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series APEX II
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.425V~1.575V
Base Part Number EP2A40
Number of I/O 540
Number of Logic Elements/Cells 38400
Total RAM Bits 655360
Number of Gates3000000
Number of LABs/CLBs 3840
In-Stock:48 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1087.92000$1087.92
500$1077.0408$538520.4
1000$1066.1616$1066161.6
1500$1055.2824$1582923.6
2000$1044.4032$2088806.4
2500$1033.524$2583810

EP2A40B724I8 Product Details

EP2A40B724I8 Overview


A 724-BBGA, FCBGA package contains it, and it is available for download. This device features 540 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 38400 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 1.425V~1.575V battery. An FPGA belonging to the APEX II series is referred to as an FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. In order to save space, this FPGA model has been contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 655360 bFpga chipss. In order to find related parts, you can use its base part number EP2A40. Fpga electronics contains 3840 LABs/CLBs in an array. Among its basic building blocks, there are 3000000 gates that are included in it. There is a device package provided by 724-BGA (35x35), which is the supplier.

EP2A40B724I8 Features


540 I/Os
Up to 655360 RAM bits

EP2A40B724I8 Applications


There are a lot of Intel EP2A40B724I8 FPGAs applications.

  • Server Applications
  • Software-defined radios
  • Medical Applications
  • Telecommunication
  • Integrating multiple SPLDs
  • Security systems
  • Random logic
  • Data Mining
  • Artificial intelligence (AI)
  • Distributed Monetary Systems

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