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EP2A15B724C7DM

EP2A15B724C7DM

EP2A15B724C7DM

Intel

FPGAs APEX II Series 724-BBGA, FCBGA

SOT-23

EP2A15B724C7DM Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 724-BBGA, FCBGA
Supplier Device Package 724-BGA (35x35)
Operating Temperature0°C~85°C TJ
PackagingTray
Series APEX II
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.425V~1.575V
Number of I/O 492
Number of Logic Elements/Cells 16640
Total RAM Bits 425984
Number of Gates1900000
Number of LABs/CLBs 1664
In-Stock:3560 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$265.913403$265.913403
10$250.861700$2508.617
100$236.661982$23666.1982
500$223.266021$111633.0105
1000$210.628322$210628.322

EP2A15B724C7DM Product Details

EP2A15B724C7DM Overview


In the 724-BBGA, FCBGA package, you will find fpga chips. A total of 492 I/Os are programmed to ensure a more coherent data transfer. Logic blocks consist of 16640 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. This is a type of FPGA that is part of the APEX II series of FPGAs. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to save space, this FPGA model has been contained in Tray. As far as the RAM bits are concerned, this device offers you a total of 425984. Fpga electronics contains 1664 LABs/CLBs in an array. There are 1900000 gates in its basic building block. As a supplier, 724-BGA (35x35) is responsible for the package of its devices.

EP2A15B724C7DM Features


492 I/Os
Up to 425984 RAM bits

EP2A15B724C7DM Applications


There are a lot of Intel EP2A15B724C7DM FPGAs applications.

  • Data center search engines
  • Medical imaging
  • Data center hardware accelerators
  • Automotive advanced driver assistance systems (ADAS)
  • Secure Communication
  • Defense Applications
  • Distributed Monetary Systems
  • Embedded Vision
  • Industrial,Medical and Scientific Instruments
  • Camera time adjustments

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