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EP20K400EFI672-XES

EP20K400EFI672-XES

EP20K400EFI672-XES

Intel

FPGAs APEX-20KE? Series 672-BBGA

SOT-23

EP20K400EFI672-XES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 672-BBGA
Supplier Device Package 672-FBGA (27x27)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series APEX-20KE®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.71V~1.89V
Number of I/O 488
Number of Logic Elements/Cells 16640
Total RAM Bits 212992
Number of Gates1052000
Number of LABs/CLBs 1664
In-Stock:4805 items

EP20K400EFI672-XES Product Details

EP20K400EFI672-XES Overview


In the package 672-BBGA, this product is provided. This device features 488 I/Os in order to transfer data in a more efficient manner. Logic blocks consist of 16640 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. This is a type of FPGA that is part of the APEX-20KE? series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. There is an FPGA model contained in Tray in order to conserve space. Having a RAM bit size of 212992 means that this device will offer you a lot of memory. 1664 LABs/CLBs are integrated into this FPGA. As a basic building block, fpga semiconductor consists of 1052000 gates. As a supplier, 672-FBGA (27x27) is responsible for the package of its devices.

EP20K400EFI672-XES Features


488 I/Os
Up to 212992 RAM bits

EP20K400EFI672-XES Applications


There are a lot of Intel EP20K400EFI672-XES FPGAs applications.

  • Scientific Instruments
  • Automation
  • Security systems
  • Computer hardware emulation
  • DO-254
  • Embedded Vision
  • Industrial IoT
  • Wireless Communications
  • Aerospace and Defense
  • Image processing

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